Detailed information - General: Advanced I/O Module (AIOM) Form Factor - Mellanox ConnectX-6 Dx 100GbE controller - Dual QSFP28 ports - Storage Accelerations: NVMe over Fabric offloads for target - Storage protocols: iSER, NFSoRDMA, - SMB Direct, NVMe-oF, and more - T-10 Dif/Signature Handover - RDMA over Converged Ethernet: RoCE v1/v2 - Zero-Touch RoCE: no ECN, no PFC - RoCE over overlay networks - IPsec over RoCE - Selective repeat - Programmable congestion control interface... Celý popis
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Detailed information
- General:
Advanced I/O Module (AIOM) Form Factor
- Mellanox ConnectX-6 Dx 100GbE controller
- Dual QSFP28 ports
- Storage Accelerations:
NVMe over Fabric offloads for target
- Storage protocols: iSER, NFSoRDMA,
- SMB Direct, NVMe-oF, and more
- T-10 Dif/Signature Handover
- RDMA over Converged Ethernet:
RoCE v1/v2
- Zero-Touch RoCE: no ECN, no PFC
- RoCE over overlay networks
- IPsec over RoCE
- Selective repeat
- Programmable congestion control interface
- GPUDirect®
- Dynamically Connected Transport (DCT)
- Burst buffer offload
- Management and Control:
NC-SI, MCTP over SMBus and MCTP over PCI-E - Baseboard Management Controller interface
- PLDM for Monitor and Control DSP0248
- PLDM for Firmware Update DSP026
- I2C interface for device control and configuration
- Remote Boot:
Remote boot over Ethernet
- Remote boot over iSCSI
- UEFI support for x86 and Arm servers
- PXE boot
- Standards:
IEEE 802.3bs, 200 Gigabit Ethernet
- IEEE 802.3cd, 50, 100 and 200 Gigabit Ethernet
- IEEE 802.3bj, 802.3bm 100 Gigabit Ethernet
- IEEE 802.3by, 25, 50 Gigabit Ethernet supporting all FEC modes
- IEEE 802.3ba 40 Gigabit Ethernet
- IEEE 802.3ae 10 Gigabit Ethernet
- IEEE 802.3az Energy Efficient Ethernet (supports only “FastWake” mode)
- IEEE 802.3ap based autonegotiation and KR startup
- IEEE 802.3ad, 802.1AX Link Aggregation
- IEEE 802.1Q, 802.1P VLAN tagsand priority
- IEEE 802.1Qaz (ETS)
- IEEE 802.1Qbb (PFC)
- IEEE 802.1Qbg
- 25/50 Ethernet Consortium “Low Latency FEC” for50GE/100GE/200GE PAM4 links
- PCI Express Gen 3.0 and 4.0
- Power Consumption:
Maximum: 23.7W
- Operating Conditions:
Storage temperature: -40°C to 70°C (-40°F to 158°F)
- Storage humidity: 90% non-condensing relative humidity at 35°C
- Physical Dimensions:
Card PCB dimensions: 76mm x 115mm (W x D)
Parameters
NIC type
Optical
NIC speed
100
Profile
OCP 3.0
Interface
OCP 3.0
Ports
2
EAN: 672042456932
- General:
Advanced I/O Module (AIOM) Form Factor
- Mellanox ConnectX-6 Dx 100GbE controller
- Dual QSFP28 ports
- Storage Accelerations:
NVMe over Fabric offloads for target
- Storage protocols: iSER, NFSoRDMA,
- SMB Direct, NVMe-oF, and more
- T-10 Dif/Signature Handover
- RDMA over Converged Ethernet:
RoCE v1/v2
- Zero-Touch RoCE: no ECN, no PFC
- RoCE over overlay networks
- IPsec over RoCE
- Selective repeat
- Programmable congestion control interface
- GPUDirect®
- Dynamically Connected Transport (DCT)
- Burst buffer offload
- Management and Control:
NC-SI, MCTP over SMBus and MCTP over PCI-E - Baseboard Management Controller interface
- PLDM for Monitor and Control DSP0248
- PLDM for Firmware Update DSP026
- I2C interface for device control and configuration
- Remote Boot:
Remote boot over Ethernet
- Remote boot over iSCSI
- UEFI support for x86 and Arm servers
- PXE boot
- Standards:
IEEE 802.3bs, 200 Gigabit Ethernet
- IEEE 802.3cd, 50, 100 and 200 Gigabit Ethernet
- IEEE 802.3bj, 802.3bm 100 Gigabit Ethernet
- IEEE 802.3by, 25, 50 Gigabit Ethernet supporting all FEC modes
- IEEE 802.3ba 40 Gigabit Ethernet
- IEEE 802.3ae 10 Gigabit Ethernet
- IEEE 802.3az Energy Efficient Ethernet (supports only “FastWake” mode)
- IEEE 802.3ap based autonegotiation and KR startup
- IEEE 802.3ad, 802.1AX Link Aggregation
- IEEE 802.1Q, 802.1P VLAN tagsand priority
- IEEE 802.1Qaz (ETS)
- IEEE 802.1Qbb (PFC)
- IEEE 802.1Qbg
- 25/50 Ethernet Consortium “Low Latency FEC” for50GE/100GE/200GE PAM4 links
- PCI Express Gen 3.0 and 4.0
- Power Consumption:
Maximum: 23.7W
- Operating Conditions:
Storage temperature: -40°C to 70°C (-40°F to 158°F)
- Storage humidity: 90% non-condensing relative humidity at 35°C
- Physical Dimensions:
Card PCB dimensions: 76mm x 115mm (W x D)
Parameters
NIC type
Optical
NIC speed
100
Profile
OCP 3.0
Interface
OCP 3.0
Ports
2
EAN: 672042456932
Parametry
| Výrobce | Supermicro |